9th International Conference on VLSI and Applications (VLSIA 2023)

August 26 ~ 27, 2023, Dubai, UAE

Scope & Topics Call for Participation Program Schedule


9th International Conference on VLSI and Applications (VLSIA 2023) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of VLSI. Original, unpublished papers, describing research in the general area of VLSI are solicited. Both theoretical and experimental research results are welcome in the following areas, but are not limited to.

Topics of interest include, but are not limited to, the following:

  • VLSI Design
  • VLSI Circuits
  • Computer-Aided Design (CAD)
  • Low Power and Power Aware Design
  • Emerging Technologies
  • Post-CMOS VLSI
  • VLSI Applications(communications, video, security, sensor networks, etc.,)
  • Nano Scale Electronic Design and Applications

Paper Submission

Authors are invited to submit papers through the conference Submission System by Closed.

Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).

Submit

Selected papers from VLSIA 2023, after further revisions, will be published in the special issues of the following journals

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Important Dates

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Second Batch : (Submissions after July 02, 2023)

Submission Deadline : Closed

Authors Notification : August 20, 2023

Registration & Camera-Ready Paper Due : August 22, 2023

Courtesy

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Invited Talk





Supported by

SIPIJ

Speakers



Diego Vallarino
Independent Researcher
Spain

Bo Mei
Texas Christian University
United States

Yuanxin Jia
USA

Zeyu Zhang
USA

Tyler Liu
USA

Daniel Miao
USA

Kaige Bao
China

Tahirou DJARA
Institut d’Innovation Technologique
Benin





Proceedings


Hard copy of the proceedings will be distributed during the Conference. The softcopy will be available on AIRCC Digital Library